- Protection from Mechanical Damage: The packaging shell protects the chip from external impacts, vibrations, and bending.
- Environmental Protection: It shields the chip from moisture, dust, and corrosive gases (such as sulfur compounds).
- Temperature Shock Resistance: By selecting materials with matching thermal coefficients (e.g., low CTE substrates), the packaging reduces thermal stress and protects the chip from temperature shocks.
Who We Are
Shanghai Yina Machinery Technology Co., Ltd., established in 2015, has years of industry experience and a registered capital of 5 million RMB. It is an innovative high-tech enterprise integrating research and development, production, sales, and service. The company is dedicated to developing centralized lubrication system products with independent intellectual property rights as its core competitive advantage, providing lubrication solutions and technical services to production enterprises and end users in industries such as port machinery, construction machinery, wind power, and intelligent manufacturing.
The company has a research, production, and sales center of nearly 2,000 square meters. Currently, it employs 40 people, including an independent design and R&D team with 3 employees holding master's degrees and 8 with bachelor's degrees. Additionally, the company holds multiple patents related to fluid and lubrication technology. It strictly follows the ISO9001 quality management system certification standards for quality control and is recognized as a high-tech enterprise in Shanghai. It is also listed as a technology-based SME in Shanghai and holds a 3A credit rating.
Product Strength Advantages
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Excellent Surface Quality
Appearance Index World No. 1
Excellent Surface Quality
Appearance Index World No. 1
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Excellent Push-Pull Strength
Higher push-pull strength and better stability.
Excellent Push-Pull Strength
Higher push-pull strength and better stability.
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HAIPU-SAC305 can suppress excessive growth of IMC.
HAIPU-SAC305 can suppress excessive growth of IMC.
our Advantage
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Physical Protection and Reliability Enhancement
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Electrical Connection and Signal Integrity
- Power Delivery: The pins or solder balls supply power to the chip (e.g., high current for CPUs).
- Signal Transmission: High-frequency signals require impedance control (e.g., microbumps in Flip-Chip packages reduce path length, ensuring faster and more efficient signal transmission).
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Miniaturization and Integration
- High-Density Interconnects: Advanced packaging technologies (e.g., Fan-Out for Apple A-series chips) enable smaller sizes with more I/O connections.
- Heterogeneous Integration: Different functional chips (e.g., CPU + memory) can be integrated within a single package, enhancing functionality and reducing space.
- 3D Stacking: Technologies like HBM (High Bandwidth Memory) use TSV (Through-Silicon Vias) for vertical stacking, improving performance while reducing the overall size.